3D Printed Metals: A Patent Landscape Analysis – 2018 

Report # SMP-PA-Metals 0718
Published October 2, 2018
Sample Not Available

New 3D Printed Metals Patent Analysis Report from SmarTech

Metals-based 3D printing is one of the fastest growing sectors of the 3D printing industry.  SmarTech has already published widely on the growing market opportunities available in this space.  Building on our extensive knowledge and understanding of this area, we are now offering an updated and revamped report on the patent landscape for 3D-printed metals. This report will be one of a series of reports on the 3D printing patent landscape.

Coverage
The 2018 report is based on an extensive search of relevant U.S. and foreign patents issued over a 20-year rolling period and patent applications published through June 2018 related to metals used for 3D printing and processes for making such metals.  This report – which is the only one of its kind — has two components: (1) a 3D printing metals patent database and (2) a visually illustrative presentation of the data in charts and graphs, accompanied by granular analysis and guidance by SmarTech’s in-house IP analyst.

This 3D printed metals patent analysis report covers such vital questions as:

Which companies are obtaining patents in the 3D printed metals space?
Top 20 companies
Cumulatively, over a 20-year rolling period
Subsisting patents
Published applications
Patent filing and issuance trends over a 20-year rolling period

Which universities and research institutions are obtaining patents in the 3D printed metals space?
Top 20 institutions
Patent filing and issuance trends over a 20-year rolling period

Who are the inventors in this space?
Top 20 inventors
Top inventors by company
Patent filing and issuance trends over a 20-year rolling period

What are the patent filing and issuance trends over a 20-year rolling period (total numbers)?
U.S.
WIPO countries

Which patents are being cited against pending applications (forward citation)?
Top 20 references, ranked
Top 20 references, by description

How is technology in this space distributed among patent classifications?
U.S. classes
International classes

How has the technology evolved, by company?
U.S. Classes
International classes

How has the technology evolved, by type?
U.S. Classes
International classes

Which countries are leading patent issuance in this space?
Top 20 countries, cumulatively
Top 20 countries, current
Top inventors, by country

How are metals patents distributed?
By type of metal
By company
By 3D printing process

How are metals applications distributed?
By process and company

What is the patent landscape for metals?
By type of metal
By 3D printing process that uses the metal
By company

What are the trends in patent abandonment in this space?
20-year rolling period

What metals patents are expiring in this space over a 3-year rolling period?

This 3D printed metals patent analysis report will be required reading for anyone who makes or uses metals for 3D printing, or who wants to identify opportunities or risks in this space.  It is aimed at CTOs, inventors and researchers, patent attorneys, investors, and others who need a comprehensive overview of the 3D printed metals patent landscape.

Patent Database
SmarTech’s patent database for 3D printed metals is based on searches for U.S. and WIPO patents and published patent applications over a 20-year rolling period. The database provides the following details: patent/publication number, assignee, title, abstract, filing date, publication date, status, PCT data, priority date, priority country, inventor, patent family information, forward citation, backward citation.

This database is provided in an Excel spreadsheet so that users can perform their own analytics with the data.

3D Printed Metals:  A Patent Landscape Analysis – 2018 will provide exceptional value to participants in every part the 3D printing community.

Chapter One: Research Findings and Summary
1.1 Patent Database
1.2 Patent Search Methodology and Cutoff
Chapter Two: Assignees
2.1 Top 50 Assignees: Cumulative U.S. Patents
2.1.1 Analysis
2.2 Top 50 Assignees: Subsisting U.S. Patents
2.2.1 Analysis
2.3 Top 50 Assignees: Published US Applications
2.3.1 Analysis
2.4 Top 20 Assignees: U.S. Patents and Applications
2.4.1 Analysis
2.5 Assignee Activity Over Time
2.5.1 Analysis
Chapter Three: Universities and Research Institutions
3.1 Top 20 Universities and Research Institutions: Patents and Applications
3.1.1 Analysis
3.2 Institutional Activity Over Time
3.2.1 Analysis
Chapter Four: Key Inventors
4.1 Top 20 Inventors
4.1.1 Analysis
4.2 Top 20 Inventors by Assignee
4.2.1 Analysis
4.3 Inventor Activity Over Time
4.3.1 Analysis
Chapter Five: Patents and Published Applications
5.1 Issued U.S. Patents and Published Applications: Trends
5.1.1 Analysis
5.2 WIPO Published Applications
5.2.1 Analysis
Chapter Six: Forward Citation
6.1 Top 20 Patent References (Forward Citation): Rank
6.1.1 Analysis
6.2 Top 20 Patent References (Forward Citation): Description
Chapter Seven: Classification
7.1 Relevant US Patent Main Classes and Subclasses - Definitions
7.2 Technology Distribution: U.S. Main Classes
7.2.1 Analysis
7.3 Technology Distribution: U.S. Main Classes – Percentage of Applications
7.3.1 Analysis
7.4 Technology Distribution: U.S. Sub-Classes
7.4.1 Analysis
7.5 Technology Distribution: U.S. Sub-Classes – Percentage
7.5.1 Analysis
7.6 Relevant International Classes
7.7 Technology Distribution: International Classifications
7.7.1 Analysis
7.8 Technology Distribution: International Classes – Percentage
7.8.1 Analysis
7.9 Technology Evolution By Assignee and U.S. Class
7.9.1 Analysis
7.10 Technology Evolution By Assignee and International Class
7.10.1 Analysis
7.11 Technology Evolution By U.S. Class
7.11.1 Analysis
7.12 Technology Evolution By International Class
7.12.1 Analysis
Chapter Eight: Top Countries By Patent Issuance
8.1 Top Countries of Patent Issuance: Cumulative
8.1.1 Analysis
8.2 Top Assignees in Top Countries
8.2.1 Analysis
Chapter Nine: Technology Analysis
9.1 Metals Patents Distribution
9.1.1 Analysis
9.2 Metals Patents by Assignee (U.S.)
9.2.1 Analysis
9.3 Metals Patents and Applications by Process (U.S.)
9.3.1 Analysis
Chapter Ten: Legal Status
10.1 U.S. Patent Abandonment: Trends
10.1.1 Analysis
10.2 U.S. Patent Survival
10.2.1 Analysis
Chapter Eleven: Expected Expiration Data
11.1 Expected Expiration Data
11.1.1 Analysis
Chapter Twelve: Closing Commentary
12.1 Top Assignees
12.2 Experience
12.3 Inventors
12.4 Worldwide Patent Filing and Issuance
12.4.1 Forward Citation
12.4.2 Patent Coverage
12.4.3 Patent Expiration
12.5 Opportunities
Chapter Thirteen: Synonym Matrix - Keywords
13.1 Important Search Terms and Alternative Terminologies
Appendix A: Databases and Acronyms
A-1 Patent databases searched
Acronyms Used In this Report
About the Analyst
About SmarTech Publishing
List of Exhibits
Exhibit 2-1: Top 50 Assignees: Cumulative U.S. Patents
Data Table for Exhibit 2-1
Exhibit 2-2: Top 50 Assignees: Subsisting US Patents
Data Table for Exhibit 2-2
Exhibit 2-3: Top 50 Assignees: Published US Applications
Data Table for Exhibit 2-3
Exhibit 2-4: Top 20 Assignees: U.S. Patents and Applications
Table 2-5: Assignee Activity Over Time
Exhibit 3-1: Top 20 Universities and Research Institutions: Patents and Applications
Table 3-2: Institutional Activity Over Time
Exhibit 4-1: Top 20 Inventors
Exhibit 4-2: Top 20 Inventors by Assignee
Table 4-3: Inventor Activity Over Time
Exhibit 5-1: Issued US Patents and Published Applications: Trends
Table 5-2: WIPO Published Applications
Exhibit 6-1: Top 20 Patent References (Forward Citation)
Exhibit 6-2: Descriptions of the top 20 forward Patent Citations for 20-Year Period
Exhibit 7.1.1: U.S. Main classes and definitions
Exhibit 7.1.2: U.S. Sub-classes and definitions
Exhibit 7-2: Technology Distribution: U.S. Main Classes
Exhibit 7-3: Technology Distribution: U.S. main Classes – Percentage of Applications
Exhibit 7-4: Technology Distribution: U.S. Sub-Classes
Exhibit 7-5: Technology Distribution: U.S. Sub-Classes – Percentage
Exhibit 7-6: International Patent classes and definitions
Exhibit 7-7: Technology Distribution: International Classes
Exhibit 7-8: Technology Distribution: International Classes -Percentage
Data Table for Exhibit 7-8
Table 7-9: Technology Evolution By Assignee and U.S. Class
Table 7-10: Technology Evolution By Assignee and IPC class
Table 7-11: Technology Evolution By U.S. Class
Table 7-12: Technology Evolution By International Class
Exhibit 7-9: Class with Least Inventive Activity
Table 8-1: Top Countries By Patent Issuance: Cumulative
Country key for Table 8-1
Table 8-2: Top Assignees in Top Countries
Table 9-1: Metals Patents Distribution
Table 9-2: Metals Patents by Assignee (U.S.)
Exhibit 10-1: U.S. Patent Abandonment Trends
Exhibit 10-2: U.S. Patent Survival
Exhibit 11-1: Expected Patent Expiration Data

Sample Not Available
Single User License (one computer) ($5,000.00)Group User License (Up To Five Computers) ($6,000.00)Enterprise User License (Unlimited Computers Within Your Organization) ($7,000.00)
Clear
  • Once you make a purchase with SmarTech, you will receive:
    • Automatic receipt and order confirmation
    • Personal customer service representative for your order
    • Report/Service emailed within 24 Hours (rush service available)
    • Printable protected PDF with personal login
    • Paid invoice for your records
  • You can be assured on the high-quality of the analysis based on our years in business and the many leading firms who have bought from us. For a partial list of our clients click here